The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

May. 10, 2024
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jason Liang, Campbell, CA (US);

Cory Yee, San Jose, CA (US);

Hoodin Hamidi, San Francisco, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 15/18 (2006.01); G11B 5/00 (2006.01); G11B 5/008 (2006.01); G11B 5/187 (2006.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
G11B 5/00817 (2013.01); G11B 5/187 (2013.01); G11B 5/3967 (2013.01);
Abstract

In a module of a tape head having multiple modules, a beam support member of at least one module has an alignment leg portion projecting from a body portion of the beam support member at a position displaced from the ends of the beam support member. The alignment leg of one module is matched with the alignment leg of another module to maximize glue adhesion between the legs and minimize positional drifting of the modules after glue curing in a staggered orientation. In another aspect, the support surface of a beam support member of a tape head module extends beyond the end of the wafer chiplet disposed on the beam support member to fully support the wafer chiplet. In still another aspect, one end of a beam support member of a tape head module is chamfered to facilitate mounting the tilted tape head assembly into a tape drive actuator.


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