The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Aug. 30, 2022
Siemens Industry Software Inc., Plano, TX (US);
Xiaoyuan Qi, Portland, OR (US);
Fan Jiang, Beaverton, OR (US);
Gaurav Veda, Hillsboro, OR (US);
Manish Sharma, Wilsonville, OR (US);
Wu-Tung Cheng, Lake Oswego, OR (US);
Siemens Industry Software Inc., Plano, TX (US);
Abstract
This application discloses a computing system to identify suspected defects in a manufactured integrated circuit, which correspond to electrical failures detected by a test applied to the manufactured integrated circuit. The computing system can utilize the suspected defects in the manufactured integrated circuit to cluster features in a physical layout design describing the manufactured integrated circuit. Each cluster of the features corresponds to a candidate for a physical root cause of the suspected defects in the manufactured integrated circuit. The computing system can detect a physical root cause of the electrical failures in the manufactured integrated circuit based on the clusters of the features. A physical failure analysis process includes an inspection of the manufactured integrated circuit to confirm the physical root cause of the electrical failures in the manufactured integrated circuit corresponds to a systemic manufacturing fault in the manufactured integrated circuit.