The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Mar. 26, 2021
Beijing Zhongxiangying Technology Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yu Wang, Beijing, CN;
Jiawei Ren, Beijing, CN;
Wangqiang He, Beijing, CN;
Haijin Wang, Beijing, CN;
Dong Chai, Beijing, CN;
Jianmin Wu, Beijing, CN;
Hong Wang, Beijing, CN;
Beijing Zhongxiangying Technology Co., Ltd., Beijing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The present disclosure provides data processing methods and apparatuses, an electronic device and a storage medium. The method includes: obtaining a product sample set; obtaining combination features in specified dimensions of the product sample set by processing a second parameter based on a preset dimension reduction algorithm; obtaining influence scores respectively for the combination features in specified dimensions based on a first parameter and the combination features in specified dimensions; obtaining at least one combination feature ranked top by sorting the combination features based on the influence scores, and taking a raw parameter corresponding to the at least one combination feature as a cause of the product defect. In the embodiments of the present disclosure, combination features in R dimensions may be a combination of raw parameters having similarity such that similar parameters are associated while raw information of the product samples is retained, thus helping fast locating the cause of the product defect, and improving the detection efficiency.