The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

May. 16, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jeong Jin Hong, Yongin, KR;

Mi Hyun Jang, Seoul, KR;

Sidharth Bhatia, Santa Cruz, CA (US);

Sejune Cheon, Seoul, KR;

Joshua Maher, Sunnyvale, CA (US);

Upendra Ummethala, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 23/00 (2006.01); G05B 19/4099 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); G05B 2219/45031 (2013.01);
Abstract

Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, generating a design of experiment (DoE) using the HOW analytics, implementing process optimization, and releasing an iteration of the process recipe. In an embodiment, the method further comprises margin testing the iteration of the process recipe.


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