System for thermal shock testing

Abstract

Systems and techniques for performing a thermal shock test are discussed herein. The thermal shock test system includes a first thermal shock unit associated with a first electronic component, a second thermal shock unit associated with a second electronic component, a first temperature regulator that maintains a first fluid at a first temperature, and a second temperature regulator that maintains a second fluid at a second temperature. The thermal shock test system may be configurable between a first configuration and a second configuration. The first configuration includes the first thermal shock unit being associated with the first fluid and the second thermal shock unit being associated with the second fluid. The second configuration includes the second thermal shock unit being associated with the first fluid and the first thermal shock unit being associated with the second fluid. The thermal shock unit may transition between the first configuration and the second configuration within a time period that causes the first electronic component and the second electronic component to experience a thermal shock. The first electronic component and the second electronic component may be evaluated for failure after the thermal shock.