The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Feb. 27, 2024
Applicant:

Benteler Automobiltechnik Gmbh, Paderborn, DE;

Inventors:

Tobias Duepmeier, Paderborn, DE;

Elmar Grussmann, Altenbeken, DE;

Guenter Fortmeier, Delbrueck, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 3/12 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 101/14 (2006.01); F28F 3/10 (2006.01); F28F 9/02 (2006.01);
U.S. Cl.
CPC ...
F28F 3/12 (2013.01); B23K 1/0012 (2013.01); B23K 1/20 (2013.01); F28F 3/10 (2013.01); F28F 9/0248 (2013.01); B23K 2101/14 (2018.08); F28F 2275/045 (2013.01); F28F 2275/06 (2013.01);
Abstract

A heat exchanger plate which has a plate body formed from at least two plate elements and at least one connecting piece for a cooling fluid. The plate body and connecting piece are joined together using soldering. The connecting piece has a joining portion which is joined in a receiving portion of the plate body formed between the plate elements. A solder resist limits the flow of solder when producing the solder connection. The solder resist is able to be formed by a sealing metal, which is arranged on the joining portion of the connecting piece in front of and/behind a solder material applied to the joining portion. The solder resist is able to be formed by an annular bead resting on the end face of the receiving portion.


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