The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Dec. 15, 2022
Applicant:

Agilent Technologies, Inc., Santa Clara, CA (US);

Inventors:

Vannie Lu, Billerica, MA (US);

George Galica, Worcester, MA (US);

Assignee:

Agilent Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F04C 29/04 (2006.01); F04C 18/02 (2006.01); F04C 29/00 (2006.01); F04D 25/06 (2006.01); F04D 29/52 (2006.01); F04D 29/58 (2006.01); H02K 9/06 (2006.01);
U.S. Cl.
CPC ...
F04C 29/045 (2013.01); F04C 18/0215 (2013.01); F04C 29/0057 (2013.01); F04C 29/047 (2013.01); F04D 25/06 (2013.01); F04D 29/522 (2013.01); F04D 29/584 (2013.01); H02K 9/06 (2013.01);
Abstract

An enclosure for a fluid pump includes an outer shell defining an enclosure interior, a stator holder disposed in the enclosure interior and at least partially surrounding a motor stator of a motor, and conduits configured to direct air through the enclosure interior. The outer shell includes air inlets positioned to allow air to flow from an ambient space outside of the enclosure into the enclosure interior, and air outlets positioned to allow air to flow from the enclosure interior to the ambient space. The enclosure defines air flow paths running from at least some of the air inlets, to and through the air conduits, and from the air conduits to at least some of the air outlets, thereby cooling the motor during operation. Electronics may be positioned in the enclosure interior, which may also be cooled by the configuration of the enclosure.


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