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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12509591 B1

PDFFull Text
Date of Patent:
Dec. 30, 2025

Filed:

Mar. 24, 2022

Conductive polymer adhesive and method of preparing the same

Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Heesuk Kim, Seoul, KR;

Jeein Jung, Seoul, KR;

Seungjun Chung, Seoul, KR;

Jeonggon Son, Seoul, KR;

Phillip Lee, Seoul, KR;

Youngpyo Ko, Seoul, KR;

Assignee:

Korea Institute of Science and Technology, Seoul, KR;

Attorney:

Studebaker Brackett PLLC

Primary Examiner:

Scott R Walshon

Int. Cl.
CPC ...
C09D 183/04 (2006.01); C08J 7/04 (2020.01); C08J 7/044 (2020.01); C08K 9/04 (2006.01); C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/62 (2018.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08J 7/0427 (2020.01); C08J 7/044 (2020.01); C09D 7/62 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 183/04 (2013.01); H01B 1/22 (2013.01); C08J 2483/04 (2013.01); C08K 9/04 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01);
Abstract

Disclosed is a conductive polymer composite according to various embodiments of the present invention in order to implement the above-described object. The conductive polymer composite may include a polymer adhesive which includes a curable polymer and a curing agent, a conductive filler made of a metal having electrical properties, and a substituting agent configured to substitute for or remove a lubricant layer applied on the conductive filler.

Find Patent Forward Citations

Kim, Heesuk. (2025). Conductive polymer adhesive and method of preparing the same (U.S. Patent No. 12509591). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12509591

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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