The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Nov. 04, 2020
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventor:
Tatsuya Kikuchi, Hiratsuka, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08G 64/04 (2006.01); C08K 3/22 (2006.01); C08K 7/14 (2006.01); C08K 9/02 (2006.01); H01Q 1/24 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 64/04 (2013.01); C08K 3/22 (2013.01); C08K 7/14 (2013.01); C08K 9/02 (2013.01); H01Q 1/243 (2013.01); H05K 1/0373 (2013.01); C08K 2003/2231 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2251 (2013.01); C08K 2201/001 (2013.01); C08K 2201/014 (2013.01); H05K 2203/107 (2013.01);
Abstract
Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of Rand Rindependently represents a hydrogen atom or a methyl group, and Wrepresents a single bond or a divalent group).