The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Oct. 23, 2023
Applicant:

Wichita State University, Wichita, KS (US);

Inventors:

Jeswin Joseph Chankaramangalam, Wichita, KS (US);

Timothy Arthur Chavez, Wichita, KS (US);

Assignee:

WICHITA STATE UNIVERSITY, Wichita, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/00 (2006.01); B29C 33/30 (2006.01); B29C 33/38 (2006.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 33/0088 (2013.01); B29C 33/302 (2013.01); B29C 33/3835 (2013.01); B29C 33/3842 (2013.01); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

A mold for use in molding a surface of a component is formed from separate building blocks that are assembled together so that mold surface segments associated with each of the building blocks line up to form one contiguous mold surface that corresponds with the shape of the mold. The building blocks can be formed to have integral formations for connecting them together. The building blocks can be formed by modeling the contiguous mold surface, dividing this first mold model into sections which define discrete building block models, and then forming each building block separately based on the discrete building block models. For instance, the individual block models can be assigned to different additive manufacturing machines and then later be assembled together at a final location.


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