The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Mar. 23, 2023
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Marius Münzinger, Nuremberg, DE;

Christoph Nöth, Eckental, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/02 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
B21D 53/022 (2013.01); H01L 21/4878 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); Y10T 29/4935 (2015.01);
Abstract

In a method for producing a heat sink, a semifinished product of a first metal material is placed into a die and a material layer of a second metal material of a higher thermal conductivity than the first metal material is releasably connected to a pressure surface of a punch. The punch is brought into contact via the material layer with the semifinished product in the die. The heat sink is formed by pressing the first metal material of the semifinished product by the punch through openings of the die fins of the heat sink are formed and into a peripheral rebate of the punch a peripheral side wall of the heat sink, wherein the material layer is connected over its entire surface to the first metal material of the semifinished product. The punch is released from the material layer, and the heat sink is ejected from the die.


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