The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Nov. 01, 2021
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Indrani Bhattacharyya, Newark, CA (US);
Julia Anne Dorothee Brueckner, Nieder-Olm, DE;
Ya-Huei Chang, Zhudong Township, TW;
Bokyung Kong, Hwaseong-si, KR;
Prantik Mazumder, Ithaca, NY (US);
Jun Ro Yoon, Painted Post, NY (US);
Jian-Zhi Jay Zhang, Ithaca, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/312 (2013.01); H01L 41/08 (2006.01); H01L 41/187 (2006.01); H01L 41/337 (2013.01); H10N 30/00 (2023.01); H10N 30/072 (2023.01); H10N 30/086 (2023.01); H10N 30/853 (2023.01);
U.S. Cl.
CPC ...
H10N 30/072 (2023.02); H10N 30/086 (2023.02); H10N 30/708 (2024.05); H10N 30/8542 (2023.02);
Abstract
An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.