The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Feb. 19, 2024
Samsung Display Co., Ltd., Yongin-Si, KR;
Woo Yong Sung, Yongin-si, KR;
Seungyong Song, Yongin-si, KR;
Samsung Display Co., Ltd., Yongin-Si, KR;
Abstract
An electronic device is disclosed that includes a base layer, a pixel defining film disposed on the base layer and having a light emitting opening defined therein, a barrier rib disposed on the pixel defining film, having conductivity, and including a first portion having a first barrier rib opening corresponding to the light emitting opening and a second portion insulated from the first portion, a light emitting element disposed in the light emitting opening and including an anode, an intermediate layer disposed on the anode, and a cathode disposed on the intermediate layer and connected to the first portion, a first encapsulation layer covering the cathode, a second encapsulation layer covering the light emitting opening and the first barrier rib opening, a third encapsulation layer disposed on the second encapsulation layer, and a sensor disposed on the light emitting element and including a first sensor electrode and a second sensor electrode, wherein the sensor includes a first conductive layer disposed between the second encapsulation layer and the third encapsulation layer and a second conductive layer disposed on the third encapsulation layer, and the first conductive layer is electrically connected to the second portion through the first encapsulation layer.