The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Dec. 27, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Gyeom Kim, Suwon-si, KR;

Dahye Kim, Suwon-si, KR;

Jinbum Kim, Suwon-si, KR;

Kyungbin Chun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/13 (2025.01); H01L 21/02 (2006.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 62/832 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 62/151 (2025.01); H01L 21/02532 (2013.01); H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 62/832 (2025.01); H10D 64/017 (2025.01);
Abstract

An integrated circuit (IC) device includes a fin-type active region, a channel region on the fin-type active region, a gate line surrounding the channel region, an outer insulating spacer covering a sidewall of the gate line, a source/drain region on the fin-type active region, wherein the source/drain region includes a buffer layer including a portion in contact with the channel region and a portion in contact with the fin-type active region, the buffer layer including an edge buffer portion having a smaller thickness than other portions thereof at a position adjacent to the outer insulating spacer, a local buffer pattern including a wedge portion, the wedge portion filling a space defined by the edge buffer portion and the outer insulating spacer, and a main body layer in contact with each of the buffer layer and the local buffer pattern.


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