The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Dec. 30, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyung Don Mun, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes first and second semiconductor dies on a buffer die. The first semiconductor die includes first memory blocks on a first semiconductor substrate, a first interlayer dielectric layer, a first through via penetrating the first semiconductor substrate and connected to the buffer die, and first conductive pads on the first interlayer dielectric layer and connected to the first memory blocks. The second semiconductor die includes first calculation blocks on a second semiconductor substrate and configured to calculate data received from the first memory blocks and store results to the first memory blocks, a second interlayer dielectric layer, and second conductive pads below the second interlayer dielectric layer and connected to the first calculation blocks. A top surface of the first interlayer dielectric layer contacts the second interlayer dielectric layer. The first conductive pads contact the second conductive pads.