The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Dec. 20, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Hiromitsu Itamoto, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Solder () joins together a second conductive pattern () of a flexible substrate () and a third conductive pattern () of a print substrate () and joins together a second GND pattern () of the flexible substrate () and a third GND pattern () of the print substrate (). A through hole () passes through the flexible substrate () and connects the first and second GND patterns () together. In an extension direction in which the second conductive pattern () extends, an end portion of a solder joint portion between the second conductive pattern () and the third conductive pattern () is in a position corresponding to the through hole () and is shifted from an end portion of the through hole ().