The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Aug. 21, 2023
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventor:
Norikazu Kume, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0306 (2013.01); H05K 3/188 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/107 (2013.01);
Abstract
An electronic component package includes a base, a lid, and a bonding layer part. The lid has a first recess. The lid is bonded to the base with a bonding layer part interposed therebetween. The base closes the first recess of the lid. The base and the lid define an internal space of the electronic component package. An electronic component is located in the internal space of the electronic component package. The electronic component is mounted on the base.
Kume, Norikazu. (2025). Electronic component package and method for manufacturing electronic component package (U.S. Patent No. 12507346). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12507346
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile