The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Sep. 25, 2023
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Hiromichi Kitajima, Nagaokakyo, JP;
Kiyoshi Aikawa, Nagaokakyo, JP;
Yoshihiro Daimon, Nagaokakyo, JP;
Takashi Yamada, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.