The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jun. 07, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yukiya Yamaguchi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module includes: a module substrate that has major surfaces that face each other; a resin member for covering at least a part of the major surface; a shield electrode layer for covering at least a part of a surface of the resin member; a plurality of post electrodes placed on the major surface; a power amplification component placed on the major surface; and a first metal electrode (for example, a shield electrode layer). The power amplification component includes: a base material that has major surfaces that face each other, the major surface being located between the major surface and the major surface; and an amplification transistor formed on the base material. The first metal electrode is placed on the major surface and is in contact with the shield electrode layer.