The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Dec. 01, 2023
Applicant:

Sitime Corporation, Santa Clara, CA (US);

Inventors:

Carl Martin Arft, Danville, CA (US);

Sassan Tabatabaei Zavareh, Sunnyvale, CA (US);

Aaron Partridge, Lakewood, WA (US);

Yushu Ma, Pittsburgh, PA (US);

Markus Rudolf Lutz, San Jose, CA (US);

Li Ko Chiu, Taoyuan, TW;

Kamran Souri, Nootdorp, NL;

Assignee:

SiTime Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/04 (2006.01); H03B 5/30 (2006.01);
U.S. Cl.
CPC ...
H03B 5/04 (2013.01); H03B 5/30 (2013.01);
Abstract

A microelectromechanical system (MEMS) device is provided with partitioning for thermal management. In one illustrative embodiment, the device may include: a heated section including a first die and a second die, wherein: the first die includes a heater, and the second die is coupled to the first die and includes a temperature sensor and a MEMS resonator; and a non-heated section communicatively coupled to the heated section and including a third die. The third die may receive a first signal associated with the temperature sensor and provides a second signal to the first die associated with the heater based on the first signal.


Find Patent Forward Citations

Loading…