The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Nov. 02, 2023
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Jeremiah D. Wolf, Atkins, IA (US);
James B. West, Cedar Rapids, IA (US);
Jiwon L Moran, Marion, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
A conformal interposer assembly for an electronically scanned array (ESA) includes a set of antenna-side conductive pads connected to an antenna element set into a printed circuit board (PCB) and conforming to a shared interconnection geometry, e.g., defining a single-axis, double-axis, or otherwise curved. Feed-side conductive pads are connected to a radio frequency (RF) feed board and likewise conform to a shared interconnection geometry, which may or may not conform to that of the antenna-side pads. Conductive vias conveys energy between the RF feed board and the antenna elements set into the PCB; for example, each conductive via may connect an antenna-side conductive pad and a counterpart feed-side conductive pad. Rigid dielectric interposers are disposed between the PCB and the feed board, providing insulation and physical bridging to the conductive vias and structural rigidity throughout the conformal assembly.