The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jul. 02, 2021
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Naoki Fukushima, Mie, JP;

Osamu Nakayama, Mie, JP;

Katsushi Miyazaki, Mie, JP;

Mitsutoshi Morita, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/519 (2021.01); H01M 50/298 (2021.01); H01M 50/516 (2021.01); H01R 12/65 (2011.01); H01R 12/78 (2011.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01M 50/519 (2021.01); H01M 50/298 (2021.01); H01M 50/516 (2021.01); H05K 1/0281 (2013.01); H05K 1/189 (2013.01); H01R 12/65 (2013.01); H01R 12/78 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.


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