The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jan. 02, 2023
Pixart Imaging Inc., Hsin-Chu, TW;
Sai-Mun Lee, Penang, MY;
Chee-Pin T'ng, Penang, MY;
PIXART IMAGING INC., Hsin-Chu, TW;
Abstract
A sensor packaging method and a sensor package are provided. The method includes: providing a substrate having upper and lower board surfaces, in which the upper board surface has a die-bonding region. The substrate includes a core material layer, an upper metal layer, and an upper protection layer, a first window is formed to penetrate the upper protection layer and located at a periphery of the die-bonding region, and the first window is opened for a first ground electrode connected to a first ground portion. The method further includes: performing a dispensing step to apply an adhesive material on the upper board surface in at least a portion of the die-bonding region; and attaching a sensor die to the substrate through the adhesive material, in which the sensor die is disposed in the die-bonding region and has a first ground pin electrically connected to the first ground electrode.