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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12506091 B1

PDFFull Text
Date of Patent:
Dec. 23, 2025

Filed:

Jul. 27, 2021

Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having same

Applicant:

Point Engineering Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Bum Mo Ahn, Gyeonggi-do, KR;

Seung Ho Park, Gyeonggi-do, KR;

Sung Hyun Byun, Gyeonggi-do, KR;

Assignee:

POINT ENGINEERING CO., LTD., Chungcheongnam-do, KR;

Attorney:

JCIPRNET

Primary Examiner:

Theresa T Doan

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H01L 23/498 (2006.01); H01L 23/525 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/14 (2013.01); H01L 23/32 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/525 (2013.01); H01L 23/528 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract

The present invention relates to an anodized film substrate base made of an anodized oxide film, an anodized film substrate part including a vertical conductive part provided inside the anodized film substrate base, an anodized film-based interposer having same, and a semiconductor package having same.

Find Patent Forward Citations

Ahn, Bum. (2025). Anodized film substrate base, anodized film substrate part having same, anodized film-based interposer having same, and semiconductor package having same (U.S. Patent No. 12506091). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12506091

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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