The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Nov. 28, 2023
Korea Electronics Technology Institute, Seongnam-si, KR;
Korea Electronics Technology Institute, Seongnam-si, KR;
Abstract
There is provided a communication chip package integrating an antenna and a heat dissipation ground. In the integrated package according to an embodiment, a heat dissipation ground is coupled to a high frequency communication chip package, an antenna patch is directly disposed on an upper portion of a mold of a ceramic material, changes are made to the structure of the ceramic mold to minimize a wire bonding length to a communication chip, a capacitive power feeding method is applied through a sidewall of the ceramic mold, and heat is discharged through a lower portion of the package and also through a PCB or an additional heat dissipation structure of a lower portion of the PCB. Accordingly, an insertion loss may be minimized and an effect of heat dissipation may be maximized.