The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Aug. 14, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Nobutake Tsuyuno, Tokyo, JP;
Yujiro Kaneko, Hitachinaka, JP;
Akira Matsushita, Hitachinaka, JP;
Masahito Mochizuki, Tokyo, JP;
Eiichi Ide, Tokyo, JP;
Junpei Kusukawa, Tokyo, JP;
HITACHI ASTEMO, LTD., Hitachinaka, JP;
Abstract
A sheet-shaped memberincluding a resin insulating layerand a metal foilis used. The sheet-shaped memberis deformed following warpage or step difference in a second conductor plateand a fourth conductor plate, and therefore, the thickness of the resin insulating layercan be set to a constant thickness of, for example, 120 μm capable of securing insulation properties. By plastically deforming a metal-based heat conduction memberhaving a thickness of, for example, 120 μm interposed between the sheet-shaped member 440 and a cooling member, the thickness of the metal-based heat conduction memberis changed to absorb the warpage or step difference generated in the second conductor plateand the fourth conductor plate. This results in remarkable improvement in heat dissipation as compared with a case where the conductor plates are brought into contact with the cooling membervia an insulating layer alone.