The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jul. 22, 2025
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Tomohisa Mizoguchi, Ichinomiya, JP;
Keita Yamana, Nagoya, JP;
Kazuhiro Nobori, Handa, JP;
Kentaro Kimura, Nagoya, JP;
Yoshinobu Goto, Nagoya, JP;
Assignee:
NGK INSULATORS, LTD., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68757 (2013.01); H01L 21/6833 (2013.01);
Abstract
A member for a semiconductor manufacturing apparatus includes a ceramic base material and a conductor. The conductor is arranged in the ceramic base material. The ceramic base material contains a ceramic material having a thermal expansion coefficient of from 2.0×10/° C. to 10.0×10/° C. and spinel. The conductor includes a surface layer containing spinel and a skeleton positioned inside the surface layer.