The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Oct. 12, 2023
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Akira Ebisawa, Tokyo, JP;

Hideyuki Kobayashi, Tokyo, JP;

Takaaki Morita, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/042 (2006.01); H01G 9/028 (2006.01); H01G 9/15 (2006.01); H01G 9/04 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0425 (2013.01); H01G 9/028 (2013.01); H01G 9/15 (2013.01); H01G 2009/05 (2013.01);
Abstract

A solid electrolytic capacitor includes: a valve metal support having an anode terminal region and a cathode forming region and forming an anode part; and a cathode part provided in a cathode forming region of the valve metal support. The cathode part includes: a solid electrolyte layer that is disposed on a surface of a dielectric layer provided at least on the cathode forming region of the valve metal support and contains a conductive polymer; a waterproof seed layer that is disposed on a surface of the solid electrolyte layer and contains a conductive material; and a metal plating layer disposed on a surface of the waterproof seed layer. A catalytic metal having catalytic activity for plating is provided on the surface of the waterproof seed layer.


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