The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

May. 23, 2022
Applicant:

Echem Solutions Corp., Taoyuan, TW;

Inventors:

Meng-PO Liu, Taoyuan, TW;

Yu-Chun Chen, Taoyuan, TW;

Assignee:

eChem Solutions Corp., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/028 (2006.01); G02B 1/04 (2006.01); G02B 5/20 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/028 (2013.01); G02B 1/04 (2013.01); G02B 5/206 (2013.01); G03F 7/0007 (2013.01); G03F 7/0047 (2013.01);
Abstract

A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).


Find Patent Forward Citations

Liu, Meng-PO. (2025). Black light-shielding photosensitive resin composition, black matrix, black light-shielding film, frame and filling material for splicing area (U.S. Patent No. 12504686). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12504686

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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