The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Aug. 11, 2020
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Maki Itoh, Ichihara, JP;

Akihiro Nakamura, Ichihara, JP;

Michitaka Suto, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); C09J 7/38 (2018.01); C09J 2483/00 (2013.01);
Abstract

Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having a high shear storage elastic modulus and stress at 500% strain and having excellent adhesive strength. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin having 9 mol % or less of hydroxyl groups and the like, and being a mixture of (b1) an organopolysiloxane resin having a (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a (Mw) of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0 A pressure-sensitive adhesive layer obtained by curing the composition has a shear storage elastic modulus G' at 25° C. of 3.5 MPa or more, and a stress at 500% strain of 0.25 MPa or more.


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