The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Feb. 02, 2021
Applicant:
Jsp Corporation, Tokyo, JP;
Inventors:
Hidehiro Sasaki, Kaminokawa-machi, JP;
Toshio Morita, Tochigi, JP;
Assignee:
JSP Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08J 9/32 (2006.01); C08K 7/22 (2006.01); C08L 63/00 (2006.01); C08L 67/03 (2006.01); C08L 79/04 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08J 9/32 (2013.01); C08K 7/22 (2013.01); C08L 63/00 (2013.01); C08L 67/03 (2013.01); C08L 79/04 (2013.01); C08L 2207/04 (2013.01);
Abstract
A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm, and when heated at 100° C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%.