Method for embedding an rfid tag into a mat

Abstract

Disclosed is a method for embedding an electronic device, for instance an RFID tag, into a mat, the mat having a bottom support intended to contact a floor, in use, and including a first material, a walkable layer arranged on top of the bottom support, including a second material. The electronic device is supported by a solid carrier. The bottom support and the walkable layer of the mat are fully assembled, so as the mat is already available for use to walk on, before embedding the electronic device; a material of the solid carrier and the first material of the bottom support of the mat are suitable to join if contacted each other and subject to a temperature and/or a pressure above predetermined thresholds, the pressure pushing the electronic device against the bottom support. Embedding the electronic device to the mat includes placing the solid carrier on a flat portion of the bottom support of the mat; applying the pressure and/or temperature to the solid carrier; ending application of pressure and/or temperature. The step of applying pressure and/or temperature is ended after the solid carrier is melted in the solid carrier and/or dissolved, and the electronic device remains embedded in the bottom support. Embedding is not reversible and the solid carrier is no longer detachable from the bottom substrate.