The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Mar. 03, 2023
Applicants:
Yasuyuki Yamashita, Kanagawa, JP;
Hisataka Takagi, Telford England, GB;
Inventors:
Yasuyuki Yamashita, Kanagawa, JP;
Hisataka Takagi, Telford England, GB;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 10/30 (2021.01); B29C 64/165 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 10/30 (2021.01); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract
A lamination fabricating method includes forming a powder layer including a powder for three-dimensional fabrication, applying a fabrication liquid to the powder layer, repeating the forming of the powder layer and the forming the powder layer to form a fabricated object, and forming a base layer prior to the forming of the powder layer. A powder filling rate of the base layer is higher than a powder filling rate of the powder layer.