The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Apr. 15, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Corrado P. Mancini, Hopewell Junction, NY (US);
David Lokken-Toyli, White Plains, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/81 (2023.01); H01L 23/00 (2006.01); H03F 19/00 (2006.01); H05K 1/18 (2006.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H10N 60/815 (2023.02); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H03F 19/00 (2013.01); H05K 1/181 (2013.01); H10N 60/0912 (2023.02); H01L 2224/14177 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A superconducting electrical device includes one or more traveling-wave parametric amplifiers (TWPAs) on a chip that is electrically connected to a wiring layer of a substrate. The electrical connection of the chip to the wiring layer of the substrate includes, for each of the one or more TWPAs, a signal bump-bond between the TWPA and the substrate. There is a peripheral ring of ground bumps around the signal bump between the TWPA and the substrate.