The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Feb. 21, 2020
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Yoshihiko Nagahama, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
Provided is a semiconductor device that has a first wiring layer and a first insulating layer stacked therein. The first wiring layer includes a plurality of first wiring lines extending in one direction. The first insulating layer is provided on the first wiring layer. The first insulating layer forms a gap at least partially between the plurality of first wiring lines. The first insulating layer has, above the gap, a stack region in which a first insulating film and a second insulating film are stacked. The first insulating film and the second insulating film include materials different from each other.