The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Apr. 17, 2023
Zhuhai Hengqin Neogenint Intelligent Technology Co., Ltd., Zhuhai, CN;
Guangdong Institute of Intelligent Science and Technology, Guangdong, CN;
Lei Nie, Shanghai, CN;
Shiyan Li, Shanghai, CN;
Man Zhang, Shanghai, CN;
Wenping Kong, Shanghai, CN;
Su Sun, Shanghai, CN;
Abstract
The present disclosure provides a server heat dissipation system based on gravity heat pipe for dissipating heat from chip of a server, comprising: an evaporator arranged in a chassis of the server and being in thermal contact with the chip, said evaporator having a first cavity internally; a condenser arranged above the server, said condenser having a second cavity internally; and an heat-insulated pipe section passing through the chassis and connecting the evaporator and the condenser, and communicating the first cavity and the second cavity, wherein the evaporator, the condenser and the insulated pipe section are made to form a gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state by retracting and releasing heat; wherein the heat generated by the chip is transferred to the working substance in liquid state in the first cavity through the evaporator, the working substance absorbs heat and is converted into gaseous state, rising to the second cavity of the condenser through the heat-insulated pipe section, the heat of the working substance is transferred to an external environment through the condenser, and the working substance is converted into liquid state and descends to the first cavity through the heat-insulated pipe section. The present disclosure effectively solves a heat dissipation problem of the chip, while enabling to reduce the power consumption index of an environment where the server is located because the gravity heat pipe does not rely on electricity to operate.