The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Oct. 01, 2021
Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
An electrical component assembly () comprising a heat sink (), electrical components (--) arranged on the heat sink () and an interconnect () electrically connecting the electrical components (--). The heat sink () is integrated with the electrical interconnect () such that the electrical interconnect () is at least partly arranged in and extends along a cavity () of the heat sink (). The electrical interconnect () comprises at least one layer () of deposited material comprising electrically conductive material forming one or more interconnecting conductors (). The interconnect further comprises one or more dielectric layers () of deposited material which isolate the one or more interconnecting conductors (). The one or more interconnecting conductors () electrically contacts the respective electrical component in a respective contact area (-) of the cavity (). The electrical components (--) are arranged on the heat sink () such that a respective one of one or more electrical contacts (-) of the electrical components align with a respective interconnecting conductor ().