The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 05, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngwook Kim, Suwon-si, KR;

Sungwoo Lim, Suwon-si, KR;

Chankyu Lim, Suwon-si, KR;

Jonggeun Yoon, Suwon-si, KR;

Jiwoo Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C08K 7/06 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); C08K 7/06 (2013.01); C09K 5/14 (2013.01); C08K 2201/001 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.


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