The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Oct. 24, 2020
Applicant:

Goertek Inc., Shandong, CN;

Inventors:

Tao Qiu, Shandong, CN;

Xiangjun Zhang, Shandong, CN;

Tiecun Wang, Shandong, CN;

Wenjie Liu, Shandong, CN;

Assignee:

GOERTEK INC., Weifang, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G01K 1/024 (2021.01); G01P 1/02 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); G01K 1/024 (2013.01); G01P 1/026 (2013.01); G02B 27/017 (2013.01); H05K 7/20209 (2013.01);
Abstract

Disclosed is a heat dissipation method for a head-mounted device. A temperature sensor, a heat dissipation fan and a power supply are disposed in the head-mounted device. The heat dissipation method for a head-mounted device comprises: obtaining a temperature acquired by the temperature sensor and an electric quantity of the power supply periodically or in real time; and activating the heat dissipation fan when it is determined that the head-mounted device satisfies a heat dissipation condition according to the temperature and the electric quantity. Further disclosed are a head-mounted device and a computer-readable storage medium. By means of the present disclosure, heat dissipation can be performed on a head-mounted device in a timely manner, thereby ensuring the service life of the head-mounted device.


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