The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Aug. 23, 2022
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Alexander Trotman, South Windsor, CT (US);

Kenneth J. Trotman, Granby, CT (US);

Assignee:

HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); H05K 7/20209 (2013.01); H05K 7/206 (2013.01);
Abstract

An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.


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