The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Mar. 16, 2022
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Takayoshi Nirengi, Osaka, JP;
Akihiro Oishi, Osaka, JP;
Tsutomu Aisaka, Osaka, JP;
Daisuke Matsushita, Osaka, JP;
Jumpei Iwanaga, Osaka, JP;
Tadashi Tojo, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); C23C 18/38 (2006.01); H01L 21/48 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/20 (2013.01); C23C 18/38 (2013.01); H01L 21/4846 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.