The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jul. 21, 2023
Via Mechanics, Ltd., Atsugi, JP;
Yasushi Ito, Atsugi, JP;
Takumi Osanai, Atsugi, JP;
VIA MECHANICS, LTD., Kanagawa, JP;
Abstract
A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the arrayed small substrates in the large substrate to process a through hole; filling the through hole with a conductor; printing a wiring on the arrayed small substrates in the large substrate; stacking a new layer on front and back surfaces of the arrayed small substrates in the large substrate; and cutting the organic member of the large substrate to divide the large substrate into the small substrates.