The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 26, 2024
Applicant:

Beijing Zitiao Network Technology Co., Ltd., Beijing, CN;

Inventors:

Chuansheng Cheng, Beijing, CN;

Dayong Shen, Beijing, CN;

Jian Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/025 (2013.01); H05K 1/0298 (2013.01); H05K 3/4038 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09672 (2013.01);
Abstract

According to embodiments of the present disclosure, a printed circuit and manufacturing method thereof are provided. The printed circuit board comprises: a signal plane portion comprising a plurality of metal layers for transmitting a signal; a power plane portion overlaid with the signal plane portion through a connection layer and comprising a plurality of metal layers for providing power; a plurality of power vias each extending from a surface of the signal plane portion facing away from the power plane portion, through the signal plane portion, the connection layer, and the power plane portion, to a surface of the power plane portion facing away from the signal plane portion; and a plurality of signal vias each extending from a surface of the signal plane portion facing away from the power plane portion into the signal plane portion and not into the power plane portion.


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