The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 15, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Keesu Jeon, Suwon-si, KR;

Kieun Cho, Suwon-si, KR;

Myeonghui Jung, Suwon-si, KR;

Minjae Seong, Suwon-si, KR;

Sanghoon Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 3/341 (2013.01); H05K 3/3452 (2013.01); H05K 3/4007 (2013.01);
Abstract

A circuit board according to an embodiment may include a first insulating layer, a first wiring layer that is buried in the first insulating layer, a first via layer that is disposed in the first insulating layer, and a second insulating layer that is disposed on the first insulating layer, and has a first surface which is in contact with the first insulating layer, and a second surface which is opposite to the first surface. In at least a part of the second insulating layer from the second surface of the second insulating layer, a cavity is positioned, and the second insulating layer includes a first part which is a part overlapping the cavity, and a second part which is a part thicker than the first part, and the first part of the second insulating layer includes first protruding parts and first concave parts.


Find Patent Forward Citations

Quick Actions:

Jeon, Keesu. (2025). Circuit board and manufacturing method thereof (U.S. Patent No. 12501547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12501547

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…