The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Nov. 23, 2022
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Shigeru Hosokai, Hachioji, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); A61B 1/05 (2006.01); H04N 25/70 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); A61B 1/051 (2013.01); H04N 25/70 (2023.01); H05K 1/18 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An electronic module includes a first structure including a flat mounting surface on which an integrated circuit is mounted and a wiring surface including a surface including a portion that changes in a direction perpendicular to the mounting surface, a wire connected to the integrated circuit being extended on the wiring surface, a second structure disposed with a dielectric region interposed with respect to the wiring surface of the first structure, a metal pattern being provided on the second structure, and at least one spacer member that equalizes thickness of the dielectric region between the wire and the metal pattern in an entire range between the mounting surface and the wiring surface including the surface including the portion that changes in the direction perpendicular to the mounting surface.


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