The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Feb. 26, 2024
Fujifilm Corporation, Tokyo, JP;
Yusuke Fujii, Kanagawa, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
Provided are: an electronic device including a wiring board having a mounting surface, a ground electrode that defines a ground region on the mounting surface, an electronic component that is located on the mounting surface and is disposed in the ground region, an insulating protective layer that is disposed in the ground region and covers the electronic component, and an electromagnetic wave shielding layer that is provided to extend over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer, in which a void ratio S, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the ground electrode, is lower than a void ratio S, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the insulating protective layer; and a manufacturing method thereof.