The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Dec. 13, 2022
Kioxia Corporation, Tokyo, JP;
Kazuma Hasegawa, Kamakura Kanagawa, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
A semiconductor device according to an embodiment includes a substrate, a first semiconductor chip, a second semiconductor chip, a first wire and a second wire. The substrate includes a first surface. The first semiconductor chip is provided on the first surface. The second semiconductor chip is provided at a position on the first surface that is apart from a position of the first semiconductor chip in a first direction. The first wire is electrically connected to the first semiconductor chip, and is provided to extend to the side of the second semiconductor chip. The second wire is electrically connected to the second semiconductor chip, and is provided to extend to the side of the first semiconductor chip. The first wire and the second wire cross as viewed in a third direction substantially perpendicular to both of the first direction and a second direction substantially perpendicular to the first surface.