The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Apr. 11, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3185 (2013.01); H01L 2224/10125 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/365 (2013.01);
Abstract
Provided is a semiconductor package with improved reliability. The semiconductor package includes: a plurality of connection terminals on a first surface of the semiconductor device; a protection member on the first surface of the semiconductor device and partially covers side surfaces of the plurality of connection terminals such that the protective member exposes lower surfaces of the plurality of connection terminals; and a mold member that covers a side surface of the semiconductor device and a portion of the protection member such that the mold member does not cover the lower surfaces of the plurality of connection terminals.