The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Aug. 08, 2023
Applicant:

Auo Corporation, Hsinchu, TW;

Inventors:

Woei-Chyuan Yang, Hsinchu, TW;

Hsiu Lin Chan, Hsinchu, TW;

Chia Yen Lin, Hsinchu, TW;

Assignee:

AUO Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 23/50 (2013.01); H01L 24/05 (2013.01); H01L 25/18 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/06152 (2013.01);
Abstract

An electronic device includes a substrate, output pads, input pads, auxiliary pads, a driving chip, edge pad groups, first connection lines, a first electronic component, and signal lines. The input pads and the auxiliary pads are closer to an edge of the substrate than the output pads. The edge pad groups are located between the driving chip and the edge of the substrate. Each of the edge pad groups includes a first pad and a second pad. Each of the first connection lines is electrically connected to one of the auxiliary pads and one of first pads of the edge pad groups. The first electronic component has conductive portions. The first pad and the second pad of each of the edge pad groups are electrically connected to one of the conductive portions. The signal lines are electrically connected to the output pads and second pads of the edge pad groups.


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