The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 09, 2020
Applicants:

Sony Group Corporation, Tokyo, JP;

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Hirohito Miyazaki, Kanagawa, JP;

Yuji Nishida, Kanagawa, JP;

Christopher Wright, London, GB;

Bernadette Elliott-Bowman, London, GB;

Timothy Beard, London, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G01R 31/2896 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01);
Abstract

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.


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